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Electronic Systems Design: Hands-on Circuits and PCB Design with CAD Software banner
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Electronic Systems Design: Hands-on Circuits and PCB Design with CAD Software banner
Preview this course
Self-paced Advanced

Electronic Systems Design: Hands-on Circuits and PCB Design with CAD Software

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1 enrolled
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FREE
1752 min
Anytime
English
305 views
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Why enroll

Participants join this course to learn how electronic circuits are actually designed and built in practice. It helps them move from theory to real hardware by giving hands-on experience with PCB design and industry-used tools. This course is ideal for anyone who wants practical skills for projects, research, or a career in electronics

Is this course for you?

You should take this if

  • You work in Electronics & Instrumentation
  • You're a Electronics & Telecommunication / CAD & Analysis professional
  • You have 3+ years of hands-on experience in this field
  • You want to build skills in Engineering & Design, Project Management

You should skip if

  • You're new to this field with no prior experience
  • You need a different specialisation outside Electronics & Telecommunication
  • You need live interaction with an instructor

Course details

This course focuses on building a strong practical foundation in electronic circuits and printed circuit board (PCB) design. Participants learn the fundamentals of analog and digital circuits and how these circuits are implemented in real hardware. The course covers the complete PCB design flow, starting from schematic entry to PCB layout, routing, and final fabrication files. Learners work hands-on with popular CAD and simulation tools such as CircuitMaker and circuit simulators to design and verify their circuits. Practical sessions include creating PCB footprints, working with through-hole and via connections, and applying proper routing techniques. Participants also learn how to assemble PCBs, solder components, and test circuit functionality. Emphasis is given to real-world design practices, common mistakes, and debugging methods. By the end of the course, learners can confidently design, build, and test functional electronic systems.

Source:
Nptel IIT Delhi [Youtube Channel]

Course suitable for

Key topics covered

  • Intro

  • Passive Circuit Elements: R, L and C

  • Resistor color coding, surface mount capacitors and inductors on PCBs

  • Active Circuit Elements: MOSFET, BJTs

  • Network Analysis: Kirchhoff's Laws

  • Network Theorems: Thevenin, Norton, Maximum Power Transfer, etc.

  • Circuit simulations using SPICE: Operating point analysis

  • DC simulations and importing third-party models

  • Small-signal simulations, transient simulations

  • PCB substrate

  • Interconnect design

  • CMOS inverter basics

  • CMOS inverter design

  • Combinational circuit design: Part 1

  • Combinational circuit design: Part 2

  • Dynamic logic circuit design

  • Sequential logic circuit design

  • Digital design: Boolean algebra

  • Logic families, component datasheets

  • TTL / CMOS logic interfacing constraints

  • Hardware description languages: VHDL and Verilog

  • Introduction to Verilog simulation software

  • Combinational circuit simulation using iVerilog

  • Adders, multiplexer simulation using iVerilog

  • High-speed PCBs

  • Signal integrity in PCBs

  • Signal crosstalk, skews and jitter in PCBs

  • KiCad software workflow

  • KiCad design modules

Course content

The course is readily available, allowing learners to start and complete it at their own pace.

30 lectures29 hr 12 min
  1. Intro
    2 min
  2. Introduction
    68 min
  3. Passive Circuit Elements : R, L and C
    57 min
  4. Resistor color coding, Surface mount capacitors and inductors on PCBs
    67 min
  5. Active Circuit Elements: MOSFET, BJTs
    58 min
  6. Network Analysis: Kirchoff's Laws
    59 min
  7. Network Theorems : Thevenin, Norton, Maximum Power Transfer etc
    60 min
  8. Circuit Simulations using SPICE : Operating point analysis
    66 min
  9. DC Simulations and Importing Third-Party Models
    56 min
  10. Small-Signal Simulations, Transient Simulations
    56 min
  11. PCB Substrate
    60 min
  12. Interconnect design
    60 min
  13. CMOS inverter basics
    59 min
  14. CMOS inverter design
    58 min
  15. Combinational circuit design : Part 1
    63 min
  16. Combinational circuit design : Part 2
    60 min
  17. Dynamic Logic Circuit Design
    60 min
  18. Sequential Logic Circuit Design
    65 min
  19. Digital Design : Boolean Algebra
    55 min
  20. Logic Families, Component Datasheets
    57 min
  21. TTL / CMOS logic Interfacing Constraints
    55 min
  22. Hardware Description Languages : VHDL and Verilog
    62 min
  23. Introduction to Verilog Simulations Software
    62 min
  24. Combinational Circuit Simulation using iVerilog
    58 min
  25. Adders, Multiplexer Simulation using iVerilog
    65 min
  26. High-Speed PCBs
    60 min
  27. Signal Integrity in PCBs
    61 min
  28. Signal Cross-Talk, Skews and Jitter in PCBs
    63 min
  29. KiCad Software Workflow
    68 min
  30. KiCad Design Modules
    52 min

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Why people choose EveryEng

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Questions and Answers

A: A feels right because an open TVS removes the clamp and the DC/DC sees the full pulse. That's real. C tempts you if you're thinking EMC first, but the emissions angle is secondary to the electrical stress and doesn't hinge on the TVS being present or not. D matches field behavior at 40,000 km; electrolytics hate repeated excursions. B breaks down because reverse battery is handled by topology choices like series FETs or diodes, not by a unidirectional TVS that only wakes up on positive surges.

A: A lines up with IPC-2152 data for external copper and a modest rise. B sounds disciplined but quietly shifts two bases: internal layer and doubled temperature rise. C is the classic trap of grabbing IPC-2221; it underestimates width and has burned plenty of boards in the field. D feels conservative, yet it stacks an internal-layer assumption with an arbitrary factor and overshoots what the physics needs.

A: A fits if the board lived underhood with direct salt exposure, which it doesn't. B shows up early as assembly fallout, not as a mileage-driven field trend. D scares people in high-reliability circles, yet whiskers need compressive stress and time, not humidity plus bias. C matches the cabin environment: moisture, contamination, and voltage gradients quietly growing conductive paths until the failure pops.

A: A hits the contract between schematic intent and physical copper. B sounds tidy but ignores why designers separate nets logically even when copper touches. C confuses net ties with safety isolation rules from another world. D is a half-truth that skips context; sometimes it's right, sometimes it isn't, and the drawing explicitly asked for control that never made it to layout.