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Introduction to Semiconductor Devices

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Self-paced Advanced

Introduction to Semiconductor Devices

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1879 min
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English
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Why enroll

Participants join this course to develop a clear and conceptual understanding of semiconductor devices, which is crucial for advanced studies and careers in electronics and electrical engineering. The course helps bridge the gap between theoretical semiconductor physics and real-world device applications. It is especially valuable for students preparing for university exams, GATE, and other competitive examinations, as well as for learners aiming to build a strong foundation for VLSI, embedded systems, power electronics, and renewable energy domains.

Is this course for you?

You should take this if

  • You work in Automotive
  • You're a Electrical Engineering professional
  • You have 3+ years of hands-on experience in this field
  • You want to build skills in Engineering & Design, Research & Developmnet

You should skip if

  • You're new to this field with no prior experience
  • You need a different specialisation outside Electrical Engineering
  • You need live interaction with an instructor

Course details

Semiconductor devices form the backbone of modern electronics and power today’s communication systems, computers, renewable energy solutions, and consumer gadgets. This course builds a strong foundation in the basic principles of semiconductor physics and device operation. It helps learners understand how theoretical concepts translate into real electronic components used in practice. The course is designed mainly for undergraduate students of Electronics and Communication Engineering (ECE), Electrical Engineering (EE), and related disciplines who want to strengthen their core understanding of electronic devices.
Source-
NPTEL-NOC IITM

Course suitable for

Key topics covered

  • Learn how energy bands work in solids and how charge carriers behave

  • Understand how electrons and holes move through semiconductor materials

  • Study pn junction diodes and see how they work in rectifiers and basic circuits

  • Learn the structure and working of MOS capacitors

  • Understand how MOSFETs operate and why they are widely used in electronics

  • Get introduced to optoelectronic devices like LEDs and how they produce light

  • Learn the basic working of solar cells and their role in energy applications

Course content

The course is readily available, allowing learners to start and complete it at their own pace.

80 lectures31 hr 19 min
  1. Introduction to semiconductor devices
    13 min
  2. 1.1 Types of Semiconductors
    7 min
  3. 1.2 Classical Vs Quantum Mechanics
    13 min
  4. 1.3 Electrons in infinite and finite 1D potential well
    33 min
  5. 1.4 3D potential well model of atom and Bohr's model
    12 min
  6. 1.5 Covalent bonds and inter-atomic interactions in Silicon
    24 min
  7. 1.6 Energy band formation
    18 min
  8. 1.7 Electron hole pair generation
    23 min
  9. 1.8 Direct and Indirect bandgap semiconductors
    26 min
  10. 1.9 Energy levels in infinite and finite potential wells (short demo)
    5 min
  11. 2.1 Effective mass in Semiconductors
    15 min
  12. 2.2 Intrinsic carrier density
    12 min
  13. 2.3 Doping and extrinsic semiconductors
    29 min
  14. 2.4 Fermi level in extrinsic semiconductors
    29 min
  15. 2.5 Temperature dependence of Fermi level
    25 min
  16. 2.6 Temperature dependence of Fermi level
    13 min
  17. 2.7 Charge neutrality relationship
    10 min
  18. 2.8 Drift current and energy band representation of kinetic energy of carriers
    32 min
  19. 3.1 Semiconductor bands in a electric field
    22 min
  20. 3.2 Diffusion current
    16 min
  21. 3.3 Non-uniform doping
    20 min
  22. 3.4 Equilibrium Vs Nonequilibrium carrier response
    19 min
  23. 3.5 Minority carrier diffusion equation (MCDE) - Example problems
    41 min
  24. 3.6 Quasi Fermi level in nonequilibrium conditions
    20 min
  25. 3.7 Quasi Fermi level and minority carrier diffusion length
    15 min
  26. 3.8 Semiconductor device fabrication
    6 min
  27. 4.1 PN Junctions - An introduction
    22 min
  28. 4.2 PN Junction electrostatics
    33 min
  29. 4.3 Energy band diagram of PN junction
    30 min
  30. 4.4 Depletion width and peak electric field
    15 min
  31. 4.5 PN junction electrostatics - examples
    35 min
  32. 4.6 Demo of PN Junction Lab on Nanohub
    19 min
  33. 5.1 Forward and reverse biased PN junctions
    25 min
  34. 5.2 Minority carrier injection in PN junctions
    32 min
  35. 5.4 Current in reverse biased PN junction
    20 min
  36. 5.5 Depletion capacitance in PN junction
    22 min
  37. 5.6 Non-idealities in PN junction diode
    29 min
  38. 5.7 Nanohub Demo - PN Junction with applied bias
    13 min
  39. 6.1 Schottky barrier in metal-semiconductor junction
    30 min
  40. 6.2 Current flow across a Schottky barrier
    26 min
  41. 6.3 Ohmic vs rectifying contacts
    14 min
  42. 6.4 An Ideal MOS Capacitor
    21 min
  43. 6.5 Operating regimes of a MOSCAP
    15 min
  44. 6.6 Simplified band diagrams of accumulation and depletion in MOSCAP
    11 min
  45. 6.7 Inversion in a MOSCAP
    20 min
  46. 7.1 NMOSCAP in accumulation mode
    23 min
  47. 7.2 NMOSCAP in depletion mode
    16 min
  48. 7.3 NMOSCAP in inversion mode
    16 min
  49. 7.4 Exact solution vs delta-depletion approximation
    39 min
  50. 7.5 Threshold voltage in a MOSCAP
    15 min
  51. 7.6 Nanohub Demo - MOSCAP tool
    25 min
  52. 8.1 Non-ideal MOS Capacitor
    43 min
  53. 8.2 MOSCAP Capacitance-Voltage (CV) Characteristics
    35 min
  54. 8.3 Example problems with MOSCAPs
    33 min
  55. 8.4 Impact of doping, oxide thickness and temperature on CV
    22 min
  56. 8.5 Nanohub Demo - MOS CV
    18 min
  57. 9.1 Introduction to MOSFET
    23 min
  58. 9.2 Operating modes of a MOSFET
    29 min
  59. 9.3 IV Characteristics of a long channel MOSFET
    35 min
  60. 9.4 Example problems with MOSFETs
    19 min
  61. 9.5 MOSFET device metrics
    43 min
  62. 9.6 CMOS Technology
    13 min
  63. 10.1 MOSFET Scaling and technology nodes
    26 min
  64. 10.2 Limits of scaling
    30 min
  65. 10.3 Current characteristics of a short channel MOSFET
    33 min
  66. 10.4 Threshold voltage characteristics of short channel MOSFET
    25 min
  67. 10.5 MOSFETs in the 21st century
    22 min
  68. 11.1 Optical absorption and bandgap
    28 min
  69. 11.2 Introduction to solar cells
    35 min
  70. 11.3 Efficiency of a solar cell
    16 min
  71. 11.4 Types of photodetectors
    28 min
  72. 11.5 PIN and avalanche Photodectectors
    19 min
  73. 11.6 Photodetector metrics
    18 min
  74. 12.1 Radiative absoption and emission processes
    32 min
  75. 12.2 Materials for optoelectronic devices
    33 min
  76. 12.3 Operation of a light emitting diode (LED)
    18 min
  77. 12.4 LED emission spectrum
    18 min
  78. 12.5 Stimulated emission and lasing
    28 min
  79. Introduction to Semiconductor Devices 1
    49 min
  80. LIVE_Introduction to Semiconductor Devices - Prof. Naresh Kumar Emani
    44 min

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Questions and Answers

A: A permanent clamp explains the bidirectional short, the surviving fuse, and why the LDO is burning power with no load. B explains leakage and heat but not a dead short both ways. C can heat copper but doesn't present as a silicon short on a DMM. D shifts blame to the regulator yet doesn't explain the measured diode behavior upstream.

A: Recognizing the intrinsic diode path forces you to account for reverse feed, which matches real silicon behavior and DFMEA expectations. B mixes channel conduction with diode physics and drops an off-state hazard. C invents device type from a missing symbol, a classic drawing trap. D relies on documentation optimism instead of physics.

A: Working backwards, power times thermal resistance stacked on ambient gives the junction. B double-counts optimism from typical curves. C inflates temperature without a power basis. D invents convection gains without geometry or airflow.

A: Damaged BE junction explains low beta, temp-sensitive leakage, and higher Vce(sat). B would clamp voltages differently and usually kill gain entirely. C limits current but doesn't explain leakage growth. D is an operating issue, not a post-ESD signature.