Fabrication of Silicon VLSI Circuits using the MOS technology

This course explains how integrated circuits (ICs) are manufactured, starting from raw materials and moving step by step to finished chips using processes such as photolithography, etching, doping, and material layering. It introduces Moore’s Law and explains how transistor scaling has driven improvements in performance, speed, and power efficiency over time. Learners will understand the basic principles of scaling and why smaller feature sizes lead to more powerful and energy-efficient ICs. The course also discusses the physical and technological limits of scaling, including heat issues, quantum effects, and increasing manufacturing complexity. It explains how design decisions and fabrication techniques influence chip performance, reliability, and yield. Special focus is given to the economics of IC production, showing how technology nodes, production volume, and yield impact chip cost. Learners will see why advanced ICs are more expensive as equipment and process requirements grow. Real-world examples are used to show how industry balances performance, cost, and manufacturing challenges. By the end of the course, participants gain a clear understanding of both the technical and economic aspects of IC processing. Overall, the course provides a strong foundation in how modern integrated circuits are made, scaled, and priced

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